R. Jacob Baker, Ph.D.
Dr. Baker joined the faculty of the Department of Electrical Engineering at the University of Idaho on the Boise State campus in 1993 after receiving his Ph.D. in Electrical Engineering from University of Nevada, Reno and completing 8 years of work with EG&G as a design engineer. In 2000, he joined the faculty at Boise State University where he helped establish graduate programs in electrical and computer engineering. He became department chair the Electrical and Computer Engineering Department in 2004 and served in that position until 2007. He is currently a Professor of Electrical and Computer Engineering at Boise State. From 1986 to 2001, Dr. Baker`s research centered on analog circuit design for instrumentation and communication systems (sweep circuits, PLLs, data converters, modem design, fiber optic receivers and transmitters, etc.) In the last few years, he has also worked on applying fundamental digital signal processing techniques to enhance sensing in array structures including: displays, CMOS imagers, and floating-gate/nascent memory technologies (e.g., flash, chalcogenide and magnetic). Dr. Baker`s current research focuses on analog and mixed-signal circuit design for communication systems, synchronization, and data conversion especially using the K-Delta-1-Sigma modulator. His research focuses on finding and electronic replacement for the hard disk drive using nascent fabrication technologies. Dr. Baker holds over 200 granted or pending patents in integrated circuit design. Among his inventions is the K-Delta-1-Sigma modulator topology used in the Baker analog-to-digital converter. He is a member of the electrical engineering honor society Eta Kappa Nu, a licensed Professional Engineer, and the author of the books CMOS: Circuit Design, Layout, and Simulation, CMOS: Mixed-Signal Circuit Design, and a coauthor of DRAM Circuit Design: Fundamental and High-Speed Topics. He received the 2000 Best Paper Award from the IEEE Power Electronics Society and the 2007 Frederick Emmons Terman Award. View Full CV

Richard A. Blanchard, Ph.D.
Dr. Blanchard has over 35 years experience in the semiconductor and electronics industries, with Fairchild Semiconductor, Supertex, Siliconix, IXYS Corporation, Failure Analysis Associates (Exponent), IP Managers and SVEWG. Dr. Blanchard has also served as an independent consultant and expert witness in semiconductor technology, and a Professor of Electrical Engineering at Foothill College. Dr. Blanchard was previously Principal Engineer and Engineering Manager of the Electrical & Electronic Division of Failure Analysis (Exponent) Associates, where he was employed for seven years. As Division Manager, he performed numerous forensic tests and analysis of electronic and electrical systems and of semiconductor devices. These were often subject to legal disputes, particularly those involving intellectual property rights. Dr. Blanchard has testified in court and served on numerous occasions as an expert witness on technologies that include MOS, MOSFET & bipolar device technology; semiconductor device physics; microchip fabrication & analysis; electronic systems; electrical & electronic failures; ESD & EOS failures; semiconductor device/integrated circuit assembly & packaging; CMOS, DMOS & BiCMOS; power IC`s & power electronics; printed circuit board (PCB) manufacturing; semiconductor process & control. In addition, he has served as an arbitrator and a "Special Master" to the court. Dr. Blanchard has published several books and numerous articles on semiconductor technology and devices. He holds more than 130 US patents on semiconductor technology and is a member of the IEEE, the Electrostatic Discharge Society, and the International Micro-circuits and Packaging Society. He received his BSEE and MSEE degrees from MIT in 1970 and his Ph.D. in Electrical Engineering from Stanford University in 1982. View Full CV

John C. Bravman, Ph.D.
Dr. Bravman has over 25 years experience consulting for the computer, semiconductor, consumer electronics and material sciences industries with Fairchild Semiconductor Laboratories, Lockheed, National Semiconductor, Advanced Micro Devices, IBM, Intel and Applied Plasma Laboratories. Dr. Bravman currently serves at Stanford University as the Bing Centennial Professor of Materials Science and Engineering and, by courtesy, Electrical Engineering, the Freeman Thornton Vice Provost for Undergraduate Education, and Dean of the Freshman-Sophomore College. Dr. Bravman joined the Stanford faculty in 1984 after completing his B.S. (1979), M.S. (1982), and Ph.D. (1984) degrees at Stanford. From 1996 to 1999 he was Chairman of his department, and from 1992 to 2001 he was the Senior Associate Dean in the School of Engineering. Dr. Bravman has consulted and testified in numerous intellectual property litigation matters in Federal, District and ITC venues concerning integrated circuit (IC) failure processes and phenomena, mechanical behavior of thin films, high spatial resolution materials analysis, microelectronic materials analysis, electromigration phenomena, microelectronic packaging, structures and materials. He has also served the government on many review boards, including the Solid State Sciences Committee, and has served on or chaired the National Advisory Board of the Materials Programs at Sandia National Laboratories and the Chemical and Materials Sciences Program at Lawrence Livermore National Laboratories. In 1994 he was President of the Materials Research Society. Dr. Bravman teaches and advises undergraduates at all levels and directs doctoral students in the areas of silicon process technology, the mechanical properties of thin films, and transmission electron microscopy. He is co-author of over 170 research publications. He has won nine teaching and advising awards while at Stanford, served as a Resident Fellow, a University Fellow, and has chaired many university committees on integrated circuit manufacturing. View Full CV

Clyde 'Kip' M. Brown, Jr.
Mr. Brown has over 35 years experience in the semiconductor and electronics industry with GTE Sylvania, Siliconix, Intersil, Sage Enterprises, Raytheon, Fairchild, Mosel-Vitelic, Micrel and The Engineering Consortium Group. Mr. Brown has also served as an independent consultant and expert witness in semiconductor technologies, with emphasis in analog mixed signal design and process engineering and has lectured and taught courses in analog and integrated circuit design at UC Berkeley and Cogswell Polytechnical College. Mr. Brown has designed and fabricated numerous mixed signal ASICs using CMOS, Bipolar, BiCMOS and DMOS technologies. He has unique experience in low voltage CMOS and Bipolar applications including medical devices and hearing aids, on-chip optical sensors and sensor interfaces and has designed and developed circuitry used in over 30% of the hearing aid market worldwide. Mr. Brown has also designed and developed a full line of high voltage mixed signal "Smart Power" products, which received the "Top 100 products" award. Mr. Brown has testified as an expert witness in numerous high technology semiconductor litigation matters involving analog mixed signal, CMOS, Video IF circuitry, CCFl inverters, Power MOS devices, microprocessors, and semiconductor device design and process engineering. He has also served as a court appointed neutral arbitrator in complex technology. Mr. Brown has 10 US patents in semiconductor technology and is a member of NSPE/CSPE, IEEE, IMAPS (Past Chapter President), American Academy of Audiology and the International Hearing Society. He has received Bachelor`s and Master`s degrees in Applied Science Electronics from Portland State University in 1967 and 1968, respectively. View Full CV

Krishna Shenai, Ph.D.
Dr. Shenai has over 30 years of combined industry, research, academic, consulting and entrepreneurial experience with COMSAT Labs, General Electric Corporate R&D Center, Intel Corporation, The University of Wisconsin Madison, The University of Illinois - Chicago, Utah State University and the University of Toledo. Dr. Shenai has also served as an independent consultant for over 50 Fortune-2000 companies worldwide, and has testified in court on several occasions as an expert witness on matters related to intellectual property litigation. His expertise covers the physics and technology of semiconductor devices and integrated circuits used for signal and power processing, semiconductor manufacturing, low-power mixed-signal and RF/microwave electronics, power semiconductor devices and power electronics, power management, renewable energy and smart power grid, sensors and wireless communication networks, environmental sensing and ecosystem monitoring, medical devices and biomedical instrumentation, robotic surgery, and electronics system failure and reliability. He is a named inventor in 12 issued US patents and over 40 international patents, and has authored or co-authored over 350 peer-reviewed publications of which more than 100 are in IEEE journals. He has edited 3 books and contributed to 8 book chapters. He is a Fellow of IEEE, a Fellow of AAAS, a Fellow of IETE (India), a Distinguished Lecturer of IEEE Electron Devices Society, and a member of the Yugoslavian National Academy of Engineering. Dr. Shenai received his Bachelor of Technology degree in Electronics from Indian Institute of Technology - Madras in 1979, a MSEE degree from The University of Maryland - College Park, MD in 1981, and his Ph.D. degree in EE from Stanford University in 1986. View Full CV

1001
Expert has over 35 years of computer science and electrical engineering industry experience. He has prior experience in multiple engagements as a patent infringement and class action expert witness. Currently an independent consultant, he has worked for large computer manufacturers as part of engineering teams developing hardware and software systems. He has testifying and deposition experience.

• Circuit Design
• Computer Disk Drive Design
• Computer Disk Seek Servo Systems
• Host Computer Interfaces
• Integrated Disk Controller Design
• Microcontroller Interfaces
• PC BIOS Software
• PC, Windows & Embedded Software
• PC Languages

1002
Expert has over 40 years of experience in the design of semiconductor products and has a Ph.D. in Computers and Communications. He has more than 10 patents in the areas of CMOS design, cryogenic memory, and memory addressing. He has over 25 engagements as a semiconductor expert witness. His notable career includes early work in the technical areas of color television, moving to solid state electronics, LEDs and photodiodes, developing major CMOS product lines, managing microprocessor business divisions, and new processors for mainframe computers. His later career history includes business and technical management for large and small corporations in the fields of microcontrollers, ASIC and RISC systems. Currently an independent consultant, he works with clients to assist their development, analysis, and launch of new semiconductor products. He has been heavily involved in advanced technology development, operations, applications, process, packaging, marketing and business planning across many different product lines.

• Intellectual Property Research
• Patent Analysis and Evaluation
• Prior Art Search
• Expert Witness
• Litigation Damage Analysis
• ITC Action Support
• Semiconductor Memory
• Microcontroller Technology
• Microprocessor Technology
• Embedded Processors
• RISC Processors
• Digital Circuits
• Analog Circuits
• ASIC
• IP Macros
• Megacells
• DRAM, SRAM. Flash, EEPROM
• IC Packaging
• Semiconductor Process
• Plasma Etch and CVD

1005
Expert is a Ph.D. in Electrical Engineering from Stanford University and has 30 years of experience in the microprocessor field with over 30 patents. He has worked for major semiconductor manufacturers as an architecture manager, engineering manager, and principal engineer. His body of work includes the Itanium processor, graphics processors, and Pentium series, where he was involved in technical definitions, product requirements, and design options. He was also involved in early efforts of 64-bit architecture design and instruction set architecture. He has previous expert witness experience.

• Microprocessor Design
• VLSI Design
• Graphics processor Design
• Computer Architecture

1044
Expert has over 29 years of experience in the high-tech industry as Engineer, Technologist, and as a Senior Executive. He is a creative engineer with 11 US patents, mostly focused in the field of Non-Volatile Memory (EPROM/EEPROM, Flash), and is a recognized Technical Expert for over 24 years. Has hands-on experience of designing, debugging, testing, and product engineering of EPROM, EEPROM, and Flash Memory Chips and Flash Memory Cards (containing Flash memory IC and memory card controllers to confirm to PCMCIA and CompactFlash standards), and was a part of the CompactFlash standards committee. He has hands on experience in designing, simulating, implementing (using CAD tools), testing, and debugging circuits for digital, analog, memory, and logic circuits in various IC technologies such as CMOS, bi-polar, GaAs, InP, etc. . He is an experienced expert witness with numerous expert witness assignments including deposition.

• IC Design
• IC Device Physics
• EEPROM, Flash + all Non-Volatile Memory IC
• Programmable Logic IC
• Flash Cards/Smart Cards/RFID
• Memory Modules
• RF Design
• Data Encryption, Security
• Nano-Technology

1087
Expert holds a Ph.D. from Yale University. His research interests are in Natural language parsing, unification-based grammar, computational psycholinguistics, computational morphology, syntax and historical reconstruction of highly inflected languages, logic modeling of electronic commerce, artificial intelligence and logic programming on microcontrollers and computer security and ethics.

• Artificial Intelligence
• Natural Language Processing
• Logic Programming
• Computer Security & Ethics
• Microcontrollers & Electronics
• Unification-based grammar
• Logic Modeling of Electronic Commerce

1114
Expert has over twenty years of experience developing complex semiconductor circuits in the microprocessor, computing systems and telecommunications fields. He has spent most of his career at early stage/start-up high technology companies building teams, developing architecture and managing the intricacies of building a company from nothing more than an idea. Avoiding patent infringement and building patent portfolios have been key elements of the companies for which he has worked. He has expert witness experience.

• Microprocessor Architecture
• Multiprocessing Computing Systems
• Cache and Memory Subsystems
• Digital CMOS Circuits
• IO Channels
• High Pin Count/High Complexity ICs/ASICs
• Rapid IO, Fibre Channel, Infiniband and HyperTransport Busses
• SONET Communications Devices
• Optical Communications Devices
• Switching Architectures
• CMOS Circuit Artwork
• IC/System Interconnect Busses
• MEMs devices

1167
This expert has extensive experience and expertise in the electronic packaging industry, including IC packaging, passive component technology, printed circuit board technology, and circuit assembly. His professional activities include qualification of new technologies, review of electronic designs, characterization of packaging materials, audit of component suppliers and EMS providers, and root-cause analysis. He has co-authored two patents, published 40 papers, has been asked to speak to over 150 different organizations, and has provided consultation to over 250 companies worldwide.

• Printed Circuit Board (PCB) Materials and Manufacturing
• Circuit Card Assembly (CCA) Materials and Manufacturing
• Capacitor Technology
• Electronic Packaging
• IC Package Design and Materials
• Industry Practices for Qualification of IC`s, Capacitors, PCB`s, and Electronics
• Solder Metallurgy and Technology
• Failures in Electronics
• Forensic Engineering of Electronics

1263
Expert is a digital development engineer with 21-years experience performing and directing the development of complex digital systems from system architecture to component level and semi-custom LSI and VLSI implementation. He is an experienced patent litigation expert.

• ATM & Frame Relay
• Data Communications
• Data Multiplexing
• Optical Communications
• T-Carrier, SONET and SYNTRAN
• Transmission
• VLSI, ASIC Design
• X.25, TCP/IP and Ethernet Protocols

1264
Expert has over 35 years of experience in the semiconductor memory industry. He has worked extensively on both IC and system-level design projects. Expert`s products include many innovations and industry firsts. In recent years, Expert has supported several litigation actions as an Expert Witness, working with both plaintiff and defendant attorneys in cases involving intellectual property disputes. In that capacity, Expert has conducted prior-art research, written (and withstood deposition on) several expert reports, and has also testified in various trial venues, including one civil case, several ITC cases, and many actions in Federal District Courts. Expert holds multiple patents in his field.

• Cache Memory
• Circuit Design
• EEPROM
• Flash Memory
• ROM
• Semiconductor Memory Architecture
• Semiconductor Memory Technology
• SRAM & DRAM Technology

1267
Expert has over 30 years experience in power electronics, including expertise in grounding, shielding, EMI, and EMC. This includes, but is not limited to, grounding and shielding of equipment for electrical safety and signal integrity in a complex electromagnetic facility environment. His experience also extends to Plasma Electrode Pockels Cell technology, used in high-energy lasers necessary for Inertial Confinement Fusion research. This R&D effort led to demonstration and deployment of the world`s largest optical switch enabling multi-pass laser amplifiers which apertures up to 40 cm and switching 10 kilojoule optical pulses on nanosecond time-scales. His designs are a core component of National Ignition Facility, a 2 Megajoule ICF laser now under construction. Expert has authored over twenty technical papers, two book chapters and two patents in digital video processing, display, and compression. He has worked on more than 50 cases, been deposed more than 20 times and testified in 4 trials. He is a patent holder with a Ph.D. in Electrical Engineering.

• Electrical Forensic Engineering
• Shocks
• Electrical Equipment Failure
• Electric Power
• Photonics
• RF and Microwaves
• Plasma Devices
• Lasers
• Pulse Power
• High-Voltage
• Material Science
• Microelectronics
• Microfluidics
• Vacuum Systems

1276
Expert has a Ph.D. in Physics and has broad experience and depth of expertise in the various processes, process sequences, associated equipment, and manufacturing process control systems essential to competitiveness in the semiconductor and also the broader microelectronics industry, including displays and micro-electromechanical systems (MEMS). His current research includes new programs in biomaterials, biomedical MEMS, and combinatorial materials science, as well as ongoing work related to semiconductors (equipment, Si and GaN materials and processes, sensing, simulation, advanced process control, environmentally benign manufacturing) and to simulation-based learning systems for education and technical training. He is able to serve as an expert witness in the following: Semiconductor & microelectronics manufacturing, Materials & processes for semiconductor technology - Si, SiGe, GaN, Process integration & yield, Chemical vapor deposition - dielectrics, metals, semiconductors, Plasma etch & deposition, Advanced interconnect technology - Cu, low-K, Damascene, Real-time, in-situ chemical sensing, Metrology & advanced process control. Process sequences & integration for CMOS, displays, and MEMS, Ultraclean & cluster tool processing, Advanced equipment design, Optical properties & sensors, Silicides, contacts, diffusion barriers, Packaging technology, soft materials, Modeling, simulation, & optimization, Hardware/software co-design, Biomaterials, MEMS & biotechnology, Surface, interface & thin film science.

• Semiconductor & microelectronics manufacturing
• Materials & processes for semiconductor technology - Si, SiGe, GaN
• Process integration & yield
• Chemical vapor deposition - dielectrics, metals, semiconductors
• Plasma etch & deposition
• Advanced interconnect technology - Cu, low-K, Damascene
• Real-time, in-situ chemical sensing
• Metrology & advanced process control
• Process sequences & integration for CMOS, displays, and MEMS
• Ultraclean & cluster tool processing
• Advanced equipment design
• Optical properties & sensors
• Silicides, contacts, diffusion barriers
• Packaging technology, soft materials
• Modeling, simulation, & optimization
• Hardware/software co-design
• Biomaterials, MEMS & biotechnology
• Surface, interface & thin film science

1283
Expert has over 30-years of electronics engineering experience that includes Thin Film engineering, development and manufacturing. Experience includes manufacturing of magnetic recording heads, database selection, design, configuration, programming, reporting and support, including Data/Document Warehousing. Expert has experience in data integrity and security hardware, software and procedures (backup/ encryption/recovery).

• Chemistry & Electrochemistry
• Disk Drive Technology
• Electrical & Electronic Engineering
• Information Technology
• Operating System & Database S/W
• Magnetics
• Materials Science
• Test Engineering
• Tribology

1301
More than 20 years experience managing multi-disciplinary teams developing wireless communications products for Fortune 500 companies and start-ups. Directly responsible for over 60 wireless projects with a strong focus on time-to-market and design for manufacturability. Experience with fixed wireless (802.16), cellular, GPS, packet radio, broadband wireless, wireless LAN (802.11), paging, wireless local loop (WLL), CDMA, TDMA, spread spectrum and satellite communications technologies.

• Antenna Design
• Satellite Systems Design
• Broadband Communication Systems
• Wireless Communication Systems
• Consumer Electronics design
• Telemetry Systems Design

1322
Expert has extensive experience developing Application Specific Integrated Circuits (ASIC) and Programmable Logic (FPGA and PLD) products used in the design of digital computer and telecom systems. He has developed Electronic Design Automation (EDA) software products based on behavioral (C, Verilog and VHDL) synthesis and ASIC/FPGA placement-route (physical design). He created an engineering design methodology and directed a worldwide operation that released over 3000 gate array (ASIC) designs. In his capacity as an experienced technical and business leader at Intel, LSI Logic, and IBM, he performed and managed a variety of IC processing and device development projects. He has published numerous papers at IEEE and company sponsored technical conferences. Expert created and successfully implemented the business development and marketing strategy for a C to Verilog synthesis software product. Expert was a key contributor in development of various memory (DRAM, SRAM, & serial memory) and logic products. Several patents in semiconductor processing and device structures were issued along with multiple Technical Disclosure Bulletins. His experience also includes FLASH memory structures and various optical imaging and laser communication components. He has prior litigation experience including testimony at trail and deposition. He holds a Ph.D. in Electrical Engineering and holds multiple patents in his field.

• ASIC Design & Product Architecture
• FPGA/PLD Design & Architecture
• Verilog/VHDL synthesis
• Prior Art Research in IC Patents
• Semiconductor Memory
• Microprocessor Technology
• Integrated Circuit Design
• Design Automation Software

1324
Expert has received a B.S. in Aeronautical Engineering from M.I.T., a M.S. in Applied Mechanics and Electrical Engineering from the Polytechnic Institute of Brooklyn and an M.B.A. from Fairleigh Dickenson University. He has worked on the stress analysis of aircraft and nuclear reactor control drive mechanisms, the mechanical design and development and manufacturing of communications satellites, emergency power sources for telephone sites, the development of integrated circuit mask making equipment such as the Electron Beam Exposure System (EBES), the packaging of integrated circuit`s (IC`s), the physical design of and assembly processes for LED`s and LASERS and electronic subsystems such as optical data links, the development and introduction to manufacture of Direct Chip Attach (DCA) technology for assembling flip chip die onto organic printed circuit boards , the assembly and packaging technology for virtual displays, and the development of embedded passive design methodology and technology for RF Modules. He is the author of 45 technical publications/talks including contributing chapter author for two texts and has been awarded 29 patents. He has litigation support experience.

• Semiconductor Packaging Design and Assembly Processes
• Optoelectronic and MEM`s Package Design and Assembly Processes
• Electronic System Physical Design
• Reliability Analysis and Evaluation
• Stress Analysis
• Thermal Analysis
• Supply Chain Management

1360
Expert has a Ph.D. in Applied Physics from Harvard. Expert is published and has prior litigation support experience.

• Device Physics
• Flat Panel Display Technology
• High Temperature Semiconductor Technology
• Magnetic Semiconductor Technology
• Material Sciences
• Polymer Chemistry
• Thin Film Materials Technology
• Tribology

1363
Expert is an experienced electronic design engineer with expertise covering a wide range of power electronic technology including the attendant design of digital and analog circuits, magnetic devices and feedback control loops. He has demonstrated skills in establishing objectives, problem identification and solution, and addressing groups. Expert s a patent holder and has prior litigation experience.

• AC/DC Power Design
• Digital & Analog Circuit Design
• EMI Filter Design
• Feedback Control Loops
• Noise Suppression
• Power Electronics
• Switching Amplifiers
• Transformer Design

1364
Expert is a recognized expert with over 35-years of experience in design of integrated circuits, including analog, digital and RF/microwave circuits. His analog IC circuit design experience includes analog components such as PLLs, voltage regulators and linear systems. In the digital IC design, Expert has experience at the circuit level, including such structures as ESD components, level shifters, sense amps, SDRAM circuits such as DDR sequencing circuits and On-Die Termination (ODT), and . His RF/Microwave design experience includes microwave components (such as amplifiers, oscillators, mixers and switches) as well as subsystems (tuners, low-noise down converters, etc). Expert has over 25 years experience in electronic design automation (EDA) software systems, simulation and circuit design and modeling. He is a recognized expert in the field of EDA systems, simulation, and modeling. He also has experience with the design of digital and analog IC, with verilog and VHDL analysis, synthesis of digital ICs such as flash memory controllers, analyses and verification of metal interconnects and related process technology. He also has acquired expertise in the analysis of alleged source code copying. He has developed specialized analysis tools that help find the "needle in the haystack" of copied code for large source-code databases. He has identified existence of misappropriated code as well as helped to demonstrate the lack of evidence of misappropriation. During the course of his practice, Expert has analyzed such diverse code as EDA software, VoIP software, database schema, mail-list processing software, and stock-brokerage software. He is familiar with a wide variety of source-code repositories including CVS, RCS, Subversion, and Rational ClearCase. He has a Ph.D., Electrical Engineering from Stanford University and extensive litigation support experience.

• EDA Software
• Digital circuit design and simulation
• Analog IC design and analysis
• Analog circuit design
• RF and microwave circuit design
• Analysis of copied source code
• Identification of copied source code
• Analysis of copied source code
• Analysis of alleged trade secret misappropriation
• Patent infringement of source code
• Copyright infringement of source code, including database schemas

1381
Expert is a independent consultant with a Master of Science in Electrical Engineering from Stanford University. He has over 15 years of experience designing ASICs, FPGAs, and PC boards for RISC-based parallel processor systems, laser printers, network switches and routers, and other real time systems. His clients have included Apple Computer, Cisco Systems, Intel, and Texas Instruments. Expert has taught courses at engineering conferences throughout the world. Expert has prior litigation support experience and holds multiple patents.

• Application software
• Embedded systems
• Networking devices
• ASIC, FPGA & PLD Design
• Firmware
• PCBs
• Assembly language, SQL, C/C++/C#, Java, Visual Basic
• FPGAs and CPLD
• Real-time Operating Systems (RTOS)
• Bus interfacing
• Imaging (laser printers, scanners, copiers
• Device drivers
• Memory subsystems and caches
• Verilog
• Digital signal processing (DSP)
• Microprocessors

2001
Consultant has considerable experience with small, real-time operating systems and device- and driver-level system software. His experience includes digital hardware design with emphasis on hardware and software interface performance issues like interrupts and DMA, and computer bus architecture with emphasis on PCI and PCI-X. Embedded systems and firmware including: Intel x86, Motorola 68000 series including the MC68VZ328 Dragonball, 6811 and i8051 designs. He is experienced with C, 80x86 assembly and Windows programming and has many years experience with various real-time kernels with emphasis on MicroC/OS and, most recently, Linux and its real-time variants. Six years experience teaching professional seminars on real-time programming and operating systems.

• Programming Languages
• Real-time & Linux Operating systems
• Microcontrollers
• BIOS
• Device Drivers
• Microprocessor Architecture
• PCI Interface Technology
• PCMCIA Bus Interface